Packaging Components
Lids, covers, lead frames, frames, rings, shims, interposers, and custom precision metal parts.
Explore Components →
SANJIN ELECTRONICS
Precision metal components for reliable electronics packaging
Since 1997, Sanjin has grown with electronics and semiconductor packaging programs that depend on stable, repeatable manufacturing.
Each year, Sanjin supplies more than 12 billion metal lids for crystal oscillator applications, supporting timing devices used across electronic products worldwide.
The company’s work has expanded from ceramic packaging and precision stamped metal components into hermetic structures, high-power package platforms, and custom build-to-print manufacturing.
What We Build
Product families for custom package components, hermetic structures, and semiconductor package platforms.
Semiconductor Packages
Ceramic packages, plastic packages, and glass-to-metal seals for high-reliability devices.
Explore Packages →How We Make It Reliable
Sanjin supports demanding supply chains with controlled processes, traceable records, and engineering decisions that can be carried into production.
Engineering route
Requirements are reviewed before tooling, process details, and inspection focus are fixed.
Controlled process
Production work follows defined documents, operating conditions, and release routines.
Traceable release
Lots remain connected to requirements, inspection records, and shipment release.
- Choosing a selection results in a full page refresh.