BUILT FOR RELIABILITY
Since 1997, Sanjin has supported electronics and semiconductor packaging programs with precision stamped metal components, hermetic structures, and stable manufacturing routines.
Each year, Sanjin supplies more than 12 billion metal lids for crystal oscillator applications.
About Sanjin →METAL LIDS AT PRODUCTION SCALE
Metal lids are one of Sanjin’s long-standing manufacturing strengths, with more than 12 billion lids supplied each year for crystal oscillator applications.
Sanjin also manufactures TO-style caps, deep-drawn covers, stepped lids, Kovar solder rings, bimetal bonding pads, frames, and custom package interfaces for demanding electronics and semiconductor programs.
Many of these parts support long-term programs with leading electronics customers, where tooling stability, plating uniformity, dimensional consistency, and lot-level release matter.
Explore Packaging Components →
ENGINEERING DEPTH
Sanjin’s engineering work extends from precision metal components into glass-to-metal sealing, metallized ceramic circuits, and package structures where materials, interfaces, and process windows must work together.
This supports projects that require more than a stamped part: sealed feedthroughs, ceramic routing, conductive paths, thermal behavior control, and custom package development.
Explore Solutions →ENGINEERING AND QUALITY
Sanjin’s work is managed through engineering review, process control, inspection routines, traceable records, and certified quality systems.
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